Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

ABSTRACT

A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

This is a continuation-in-part of application Ser. No. 08/309,193 filedSep. 20, 1994, now U.S. Pat. No. 5,616,063, of application Ser. No.08/563,295 filed Nov. 28, 1995, now U.S. Pat. No. 5,679,059, and ofapplication Ser. No. 08/580,312 filed Dec. 28, 1995 now U.S. Pat. No.5,827,110.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a polishing method and apparatus, andmore particularly to such a method and apparatus for polishing aworkpiece such as a semiconductor wafer. Further particularly, thepresent invention relates to such a method and apparatus wherein aworkpiece to be polished and washed, particularly a dry workpiece, isloaded into the apparatus, is polished and then washed and driedtherein, and wherein the resultant clean and dry polished workpiece istransferred from the apparatus. When a dry workpiece to be polished isloaded into the apparatus and a clean and dry polished workpiece istransferred from the apparatus, the method is referred to hereinafter asa "dry-in, dry-out" method. Still further particularly, the presentinvention relates to such a "dry-in, dry-out" method and apparatusincluding a plurality of operating units disposed in an array or clusteraround at least one center robot having at least one robot arm, andhaving a transfer structure including separate and discrete transfermechanisms including at least one first transfer mechanism fortransferring a dry workpiece into the apparatus and for transferring theclean and dry polished workpiece from the apparatus, and at least onesecond transfer mechanism for transferring the workpiece betweenpolishing and washing units of the apparatus.

2. Description of Related Art

Recent rapid progress in semiconductor device integration demandssmaller and smaller wiring patterns or interconnections and alsonarrower spaces between interconnections which connect active areas. Oneof the processes available for forming such interconnections isphotolithography. Although a photolithographic process can forminterconnections that are at most 0.5 μm wide, such process requiresthat surfaces on which pattern images are to be focused by a stepper beas flat as possible because the depth of focus of the optical system isrelatively small.

It is therefore necessary to make the surfaces of semiconductor wafersflat to enable use of photolithography. One customary way of flatteningthe surfaces of semiconductor wafers is to polish them with a polishingapparatus.

Conventionally, such a polishing apparatus has a single function ofpolishing a semiconductor wafer. Therefore, in the case of washing asemiconductor wafer after polishing, the semiconductor wafer must betransferred or transported from the polishing apparatus to a washingapparatus. Further, in the case of polishing a semiconductor wafer againunder different conditions after a first polishing operation, thesemiconductor wafer must be transferred or transported from onepolishing apparatus to another polishing apparatus. In such cases, thesemiconductor wafers are manually transferred or transported by amovable container in which they are immersed in water to keep them fromdrying during transportation. However, since various apparatusesincluding a polishing apparatus and a washing apparatus areindependently installed and the semiconductor wafers are transferred ortransported by the movable container containing water therein, it isdifficult to install the polishing apparatus, the washing apparatus andthe like in a clean room of a semiconductor manufacturing plant and toautomate completely various processes including a polishing process anda washing process.

In order to solve the above problems, there has been proposed anapparatus which has a polishing unit and a washing unit provided in acommon housing. Further, if necessary, a plurality of polishing unitscan be provided in a common housing. In a polishing apparatus which hasa polishing unit and a washing unit, or a plurality of polishing unitsin a common housing, it is conceivable to construct a cluster type ofpolishing apparatus which integrates a plurality of units including apolishing unit and a washing unit, as employed in a semiconductormanufacturing process such as etching or chemical vapor deposition(CVD).

However, in the case of constructing a cluster type of polishingapparatus which integrates a plurality of units and incorporates auniversal transfer robot at a central position of the units, it isnecessary to handle both a dirty and wet semiconductor wafer soiled withabrasive slurry or particles generated by the polishing operation and aclean and dry semiconductor wafer which is placed on a loading unit oran unloading unit. Therefore, a conventional robot incorporated in acluster type of a semiconductor manufacturing processing apparatuscannot be used in a cluster type of polishing apparatus because suchrobot is not capable of handling separately both a clean semiconductorwafer and a dirty semiconductor wafer. If such conventional robot isincorporated into the polishing apparatus, a washing process and adrying process of the robot or a robot arm additionally are required,thus lowering throughput efficiency of the apparatus. Further, when suchrobot or the robot arm is left for a long time as it is, abrasivematerial or particles generated by the polishing operation adhere to therobot or the robot arm, resulting in contamination of subsequentsemiconductor wafers or respective units of the polishing apparatus.

SUMMARY OF THE INVENTION

Therefore, it is an object of the present invention to provide animproved polishing method and apparatus wherein it is possible toachieve polishing of a workpiece and then to achieve washing and dryingof the workpiece.

It is a further object of the present invention to provide such a methodand apparatus wherein workpieces to be polished that are introduced tothe apparatus are dry and wherein polished and cleaned workpieces thatare discharged from the apparatus also are dry, wherein the method andapparatus operate according to a dry-in, dry-out principle.

It is a yet further object of the present invention to provide such amethod and apparatus wherein it is possible to overcome the abovediscussed and other prior art disadvantages and to provide a muchgreater degree of manufacturing flexibility than has been possible inthe prior art.

It is an even still further object of the present invention to providesuch a polishing method and apparatus employing a cluster typearrangement of a plurality of units that perform various operations, aswell as a transfer structure including exclusive means for handling aclean semiconductor wafer and exclusive means for handling a dirtysemiconductor wafer. Thus, a transfer mechanism or mechanisms thathandle a dry semiconductor wafer to be loaded into the apparatus andthat handle a clean and dry semiconductor wafer that has been polishedand then washed and dried and that is discharged from the apparatus areexclusive, discrete and separate from a transfer mechanism or mechanismsthat transfer semiconductor wafers among polishing and washing systemsof the apparatus. Thus, dry semiconductor wafers are loaded into theapparatus, and dry semiconductor wafers that have been polished andwashed are transferred from the apparatus.

In accordance with one aspect of the present invention, there isprovided a method and apparatus wherein a workpiece to be polished istransferred from a loading unit to a polishing system, whereat theworkpiece is polished to form a polished workpiece. The polishedworkpiece is transferred from the polishing unit to a washing unitdefining washing and drying systems. The workpiece is washed and thendried at the washing unit to form a clean and dry polished workpiece.The thus clean and dry polished workpiece then is transferred from thewashing unit to an unloading unit. In accordance with a further featureof the present invention, the workpiece to be polished is transferred ina dry condition from the loading unit to the polishing unit.

According to another aspect of the present invention, there is provideda polishing method and apparatus for polishing a surface of a workpieceand washing the workpiece which has been polished. A universal transferrobot has at least one arm for transferring the workpiece. A pluralityof units are disposed around the universal transfer robot and include aloading unit for receiving thereon the dry workpiece to be polished, apolishing system including at least one polishing unit for polishing theworkpiece which is transferred from the loading unit, a washing systemand a drying system defined by at least one washing unit for washing anddrying the workpiece which has been polished, and an unloading unit forreceiving thereon the resultant washed and dried polished workpiece. Atransfer structure includes an exclusive transfer mechanism thattransfers a clean workpiece and another exclusive transfer mechanismthat transfers a dirty workpiece. The loading unit, the unloading unit,the polishing unit and the washing unit are disposed around theuniversal transfer robot. A workpiece, i.e. a dry workpiece, is pickedup from the loading unit by the universal transfer robot, transferred tothe polishing unit, and polished by the polishing unit. After thepolishing operation, the thus dirty workpiece is transferred from thepolishing unit to the washing unit by another exclusive transfermechanism and is washed and dried by the washing unit. After suchwashing and drying operations, the resultant clean and dry polishedworkpiece is transferred from the washing unit to the unloading unit bythe universal transfer robot.

According to a further aspect of the present invention, the universaltransfer robot has an arm for exclusively handling a clean workpiece andan arm for exclusively handling a dirty workpiece. The loading unit, theunloading unit, the polishing unit and the washing unit are disposedaround the universal transfer robot. A workpiece, e.g. a dry workpiece,is picked up from the loading unit by the arm for exclusively handling aclean workpiece of the universal transfer robot, transferred to thepolishing unit, and polished by the polishing unit. After such polishingoperation, the thus dirty workpiece is transferred from the polishingunit to the washing unit by the arm for exclusively handling a dirtyworkpiece of the universal transfer robot, and is washed and dried bythe washing unit. After such washing and drying operations, theresultant clean and dry polished workpiece is transferred from thewashing unit to the unloading unit by the arm for exclusively handling aclean workpiece of the universal transfer robot.

According to a still further aspect of the present invention, thetransfer structure includes two universal transfer robots each having atleast one arm for transferring the workpiece, and the plurality of unitsare disposed around the two universal transfer robots. One of theuniversal transfer robots transfers a clean workpiece and the other ofthe universal transfer robots transfers a dirty workpiece. The loadingunit, the unloading unit, the polishing unit and the washing unit aredisposed around the two universal transfer robots. A workpiece, e.g. adry workpiece, is picked up from the loading unit by the universaltransfer robot for exclusively handling a clean workpiece, transferredto the polishing unit, and polished by the polishing unit. After suchpolishing operation, the thus dirty workpiece is transferred from thepolishing unit to the washing unit by the universal transfer robot forexclusively handling a dirty workpiece, and is washed and dried by thewashing unit. After such washing and drying operations, the resultantclean and dry polished clean workpiece is transferred from the washingunit to the unloading unit by the universal transfer robot forexclusively handling a clean workpiece.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of an embodiment of a polishingapparatus according to the present invention;

FIG. 2A is a schematic plan view of part of the polishing apparatusaccording to the present invention;

FIG. 2B is a schematic plan view of a washing unit in the polishingapparatus according to the present invention;

FIG. 3 is a cross-sectional view taken along line A1-A2 of FIG. 2A;

FIG. 4 is a cross-sectional view taken along line B1-B2 of FIG. 2A;

FIG. 5 is a cross-sectional view taken along line D1-C3-C2-C1 of FIG.2A;

FIG. 6 is a cross-sectional view taken along line D1-D2 of FIG. 2A;

FIG. 6A is a view similar to FIG. 6, but showing a modified washingunit;

FIG. 7 is a schematic plan view of a second embodiment of a polishingapparatus according to the present invention;

FIG. 8 is a schematic plan view of a third embodiment of a polishingapparatus according to the present invention;

FIG. 9 is a schematic plan view of a fourth embodiment of a polishingapparatus according to the present invention;

FIG. 10 is a schematic plan view of a fifth embodiment of a polishingapparatus according to the present invention; and

FIG. 11 is a schematic plan view of a sixth embodiment of a polishingapparatus according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Each of the embodiments will be described with reference to polishing aworkpiece in the form of a semiconductor wafer.

A first embodiment of a polishing apparatus according to the presentinvention will be described below with reference to FIG. 1. As shown inFIG. 1, the polishing apparatus has a center robot 10 having arms 10-1and 10-2 at a central part thereof. The center robot 10 constitutes auniversal transfer robot. Around the center robot 10 and in the areathat can be accessed by the arm 10-1, there are provided a loading unit11 on which a semiconductor wafer S to be polished, e.g. a drysemiconductor wafer, is placed, an unloading unit 12 on which a cleanand dry semiconductor wafer S which has been polished and then cleanedand dried is placed, a polishing system including polishing units 13 and14 each for polishing the semiconductor wafer S, and a washing systemand a drying system including washing unit 15 for washing and drying thepolished semiconductor wafer S.

The polishing unit 13 has a polishing head supporting arm 13-3, aturntable 13-4 and a top ring rotatably provided on the polishing headsupporting arm 13-3. The polishing unit 14 has a polishing headsupporting arm 14-3, a turntable 14-4 and a top ring rotatably providedon the polishing head supporting arm 14-3. An abrasive cloth is attachedto each of respective upper surfaces of the turntables 13-4 and 14-4.Each of the polishing head supporting arms 13-3 and 14-3 constitutes anexclusive transferring device for transferring the semiconductor wafer Sfrom a loading position 13-1, 14-1 of the polishing unit to theturntable 13-4, 14-4. Further, each of the polishing head supportingarms 13-3 and 14-3 constitutes an exclusive transferring device fortransferring the polished semiconductor wafer S from the polishing unit13, 14 to the washing unit 15. The polishing apparatus has a table 16for a dressing tool 16-1 for dressing the abrasive cloth on theturntable 13-4 and a table 17 for a dressing tool 17-1 for dressing theabrasive cloth on the turntable 14-4.

In the polishing apparatus, the semiconductor wafer S to be polished ispicked up under vacuum by the arm 10-1 of the center robot 10, isinverted to dispose a surface thereof to be polished downwardly, and istransferred to the loading position 13-1 of the polishing unit 13. Thetop ring of the polishing head supporting arm 13-3 holds thesemiconductor wafer S and presses the semiconductor wafer S against theabrasive cloth attached to the upper surface of the turntable 13-4. Atthis time, the turntable 13-4 is rotated, and the top ring is rotatedabout its own axis and swung on the turntable 13-4 by the polishing headsupporting arm 13-3, whereby the semiconductor wafer S is polished.

After such polishing operation, the polished semiconductor wafer S istransferred to a loading position 15-1 of the washing unit 15 by thepolishing head supporting arm 13-3. The polishing head supporting arm13-3 which releases the semiconductor wafer S at the loading position15-1 chucks dressing tool 16-1 on the table 16 and presses the dressingtool 16-1 against the abrasive cloth on the turntable 13-4, therebydressing such abrasive cloth. This dressing operation may be performedby an exclusive dressing mechanism.

The semiconductor wafer S which has been transferred to the loadingposition 14-1 of the polishing unit 14 by the arm 10-1 of the centerrobot 10 also is held by the top ring of the polishing head supportingarm 14-3 and pressed against the abrasive cloth attached to the uppersurface of the turntable 14-4. After such polishing operation, thepolished semiconductor wafer S is transferred to a loading position 15-2of the washing unit 15. Further, the polishing head supporting arm 14-3which releases the semiconductor wafer S chucks dressing tool 17-1 onthe table 17 and presses the dressing tool 17-1 against the abrasivecloth on the turntable 14-4, thereby dressing such abrasive cloth.

The polished semiconductor wafer S transferred to the loading position15-1 or the loading position 15-2 is washed and dried in the washingunit 15, and then is transferred to an unloading position 15-3. Thepolished semiconductor wafer S thus is cleaned and dried and istransferred from the unloading position 15-3 to the unloading unit 12 bythe arm 10-2 of the center robot 10. All of the above describedoperations are performed entirely automatically.

Next, the polishing unit 14 and the washing unit 15 will be described indetail with reference to FIGS. 2A through 6A that further illustrate theembodiment of the present invention shown in FIG. 1. However, FIGS.2A-6A do not illustrate a dressing tool and a table therefor, but ratherillustrate an exclusive dressing mechanism 15-11.

As shown in FIG. 2A, the semiconductor wafer S placed on the loadingunit 11 is picked up by the arm 10-1 of the center robot 10, inverted todirect its surface to be polished downwardly by a reversing mechanism11-2, and transferred to the loading position 14-1 of the polishing unit14. As shown in FIG. 3, the semiconductor wafer S is held under vacuumby the top ring 14-5 provided at the forward end of the polishing headsupporting arm 14-3 and moved above the turntable 14-4. Thereafter, thetop ring 14-5 is lowered, and the semiconductor wafer S held by the topring 14-5 is pressed against the abrasive cloth on the turntable 14-4,whereby the semiconductor wafer S is polished. The turntable 14-4 isrotated by a motor 14-6 through a timing belt 14-7 (see FIG. 4). Asshown in FIG. 5, after such polishing operation, the arm 14-3 and topring 14-5 put the semiconductor wafer S into a washing receptacle 15-4which is standing by at an opening of the loading position 15-2 of thewashing unit 15, and top ring 14-5 is washed by cleaning solvent. Duringsuch washing operation, the opening of the loading position 15-2 isclosed by a shutter 15-5. The top ring 14-5 which releases thesemiconductor wafer S is washed at the loading position by a washingmechanism of the washing unit 15.

After such washing operation, the semiconductor wafer S is moved indirection a (FIG. 5) and transferred to a reversing or invertingmechanism 15-6 by which the semiconductor wafer S is inverted to disposeits surface which has been polished upwardly and supplied to a primarywashing station 15-7. A primary washing operation is carried out usingcleaning solvent such as pure water at the primary washing station 15-7.Thereafter, the semiconductor wafer S is picked up by a transfer robot15-8 in the washing unit 15, moved in directions of arrows b and c andfed to a secondary washing station 15-9. A secondary washing operationis carried out using cleaning solvent such as pure water at thesecondary washing station 15-9.

After the secondary washing operation, the semiconductor wafer S isdried. Thus, the workpiece may be dried in the manner shownschematically in FIG. 6, wherein after the secondary washing operationat station 15-9, the wafer is dried by a drying system, in thisembodiment spin-dried by spinning a wafer holding station at high speed,for example by a motor. This spinning is indicated schematically by thecircular arrow in FIG. 6. The thus washed and dried polished wafer thenis picked up by the arm 10-2 of the center robot 10, moved in directionsof arrows d and e as shown in FIG. 6, and transferred to the unloadingunit 12. As shown in FIG. 2A, dressing mechanism 15-11 dresses theabrasive cloth on the turntable 14-4. The dressing mechanism 15-11 has arotating brush 15-12 as shown in FIG. 3.

An alternative drying arrangement is shown schematically in FIG. 6A.Thus, the washing and drying system include a washing unit having aseparate secondary washing station 15-9A and a separate drying station15-9B. After secondary washing in station 15-9A, the thus cleaned waferis transferred, for example by arm 10-2 of robot 10, to drying station15-9B whereat the wafer is dried. The thus cleaned and dried polishedwafer then is transferred by arm 10-2 of robot 10 and moved further indirection e to unloading unit 12.

The drying arrangements shown schematically in FIGS. 6 and 6A may be inaccordance with the structures shown in Ser. No. 08/563,295 and Ser. No.08/580,312, the disclosures of which hereby are incorporated herein byreference.

In accordance with the present invention, the entire apparatus iscompact in enclosing structure, e.g., size and therefore may bepositioned in a housing unit 30, shown schematically in FIGS. 6 and 6A.When housing unit 30 is provided with a necessary exhaust duct system,the polishing apparatus can be installed in a clean room withoutlowering the cleanliness thereof, without requiring a large amount ofspace in the clean room, and at any suitable and flexibly movableposition within the clean room.

According to the first embodiment, the polishing apparatus comprises acenter robot 10 having arms 10-1 and 10-2 and constituting a universaltransfer robot for transferring the semiconductor wafer S to therespective units, a plurality of units disposed around the center robot10 and including a loading unit 11 for receiving thereon thesemiconductor wafer S to be polished, an unloading unit 12 for receivingthereon the clean and dry semiconductor wafer S which has been polished,polishing units 13 and 14 each for polishing the semiconductor wafer S,and a washing unit for washing and drying the polished semiconductorwafer S. The polishing apparatus further comprises a polishing headsupporting arm 13-3 having a top ring for transferring the semiconductorwafer S between two adjacent units and a polishing head supporting arm14-3 having a top ring for transferring the semiconductor wafer Sbetween two adjacent units. A transfer structure includes center robot10 that handles clean and dry semiconductor wafers S, and the polishinghead supporting arms 13-3 and 14-3 that handle dirty and wetsemiconductor wafers S. Particularly, center robot 10 handles a, e.g.dry, semiconductor wafer S from the loading unit 11 to the loadingposition of the particular polishing unit, and center robot 10 alsohandles a clean and dry polished semiconductor wafer S from theunloading position 15-3 of the washing unit 15 to the unloading unit 12.On the other hand, the polishing head supporting arms 13-3 and 14-3handle dirty and wet semiconductor wafers S from the respectivepolishing units to the washing unit.

The center robot 10 has the arm 10-1 which is exclusively used forloading the semiconductor wafer to be polished and the arm 10-2 which isexclusively used for unloading the clean and dry semiconductor waferwhich has been polished. This arrangement is preferable in a case wherethe degree of cleanliness of the semiconductor wafer S transferred fromthe loading unit 11 is different from that of the semiconductor wafer Stransferred to the unloading unit 12.

Next, a further embodiment of the polishing apparatus according to thepresent invention will be described below with reference to FIG. 7. Theparts shown in FIG. 7 which are identical to those of FIG. 1 are denotedby identical reference numerals. The polishing apparatus has a centerrobot 10 having arms 10-1 and 10-2 at a central part thereof. Around thecenter robot 10 and in an area that can be accessed by the arm 10-1,there are provided a loading unit 11, an unloading unit 12, polishingunits 13 and 14, a washing unit 15, and auxiliary spaces 18 and 19 foraccommodating additional units, in a hexagonal arrangement.

In the auxiliary spaces 18 and 19 are installed, for example, thicknessmeters for measuring a thickness of the semiconductor wafer. In suchcase, the, e.g. dry, semiconductor wafer S is held by the arm 10-1 ofthe center robot 10 and fed to the thickness meter in the auxiliaryspace 18. Before a polishing operation, the thickness of thesemiconductor wafer S is measured by the thickness meter, and then thewafer S is transferred to the loading position 13-1 of the polishingunit 13.

After a polishing operation, the polished semiconductor wafer S istransferred to the washing unit 15 in the same manner as in the firstembodiment and is washed and dried in the washing unit 15. After suchwashing operation, the clean and dry polished semiconductor wafer S isfed to the thickness meter in the auxiliary space 18 by the arm 10-1 ofthe center robot. After measuring the thickness of the semiconductorwafer S which has been polished, the clean and dry polishedsemiconductor wafer S is transferred to the unloading unit 12 by the arm10-2 of the center robot 10.

FIG. 8 shows another embodiment of the polishing apparatus according tothe present invention. The parts shown in FIG. 8 which are identical tothose of FIG. 1 are denoted by identical reference numerals. Around acenter robot 10 having arms 10-1 and 10-2 and in the area that can beaccessed thereby, there are provided, in a hexagonal arrangement, aloading unit 11, an unloading unit 12, a polishing system including twopolishing units 13 and a polishing unit 14, a washing unit 15 providedbetween the polishing unit 14 and the unloading unit 12. Thisarrangement is preferable in the case where the polishing unit 13requires twice as much time as the polishing unit 14 to polish a wafer.

In this case, the transfer of the semiconductor wafer S from thepolishing units 13 to the washing unit 15 and the transfer of thesemiconductor wafer S from the polishing unit 14 to the washing unit 15are performed, not by the center robot 10, but by another transfer meanssuch as the polishing head supporting arms 13-3 and 14-3. However, theloading of the dry semiconductor wafer to the polishing units 13 and 14and the removal of the clean and dry polished semiconductor wafer fromthe washing units 15 are performed by the arms 10-1 and 10-2,respectively, of the center robot 10. That is, the center robot 10 doesnot handle the semiconductor wafer polished by the polishing units 13and 14 so that the arms 10-1 and 10-2 of the center robot 10 are notcontaminated by the semiconductor wafer which has been polished and towhich abrasive slurry adheres.

FIG. 9 shows a still further embodiment of the polishing apparatusaccording to the present invention. The parts shown in FIG. 9 which areidentical to those of FIG. 1 are denoted by identical referencenumerals. The polishing apparatus is provided with a transfer structureincluding center robot 10 having only one arm 10-1. In the case ofproviding only the arm 10-1, the transfer structure also includesexclusive transferring devices provided between the polishing units 13and 14, and between the polishing units 13, 14 and the washing unit 15.This system is applicable to a case where the degree of cleanliness ofthe dry semiconductor wafer which is transferred from the loading unit11 is substantially the same as that of the clean and dry polishedsemiconductor wafer which is transferred to the unloading unit 12.

FIG. 10 shows a still further embodiment of the polishing apparatusaccording to the present invention. The parts shown in FIG. 10 which areidentical to those of FIG. 1 are denoted by identical referencenumerals. Around a center robot 10 having arms and in the area that canbe accessed by the arms, there are provided in a hexagonal arrangement aloading unit 11, a polishing system including four polishing units 13,14, 21 and 22, and a washing unit 15. An unloading unit 12 is disposedat the end of the washing unit 15. Further, a storage unit 23 isdisposed adjacent to the loading unit 11 and the unloading unit 12. Anautomatic guided vehicle 24 is employed to transfer a semiconductorwafer S which has been polished from the storage unit 23 and to convey asemiconductor wafer to be polished to the storage unit 23.

Loading of the semiconductor wafer S onto the polishing units 13, 14, 21and 22 and the washing unit 15 and removal of the semiconductor wafer Sfrom the loading unit 11 and the polishing units 13, 14, 21 and 22 arecarried out entirely by the center robot 10. Further, the transfer ofthe semiconductor wafer from the washing unit 15 to the unloading unit12 is carried out by the center robot 10. The center robot 10 of thisembodiment forms the transfer structure including an arm for exclusivelyhandling a clean semiconductor wafer (hereinafter referred as cleanwafer handling arm) and an arm for exclusively handling a dirtysemiconductor wafer (hereinafter referred as dirty wafer handling arm).The transfer of the, e.g. dry, semiconductor wafer from the loading unit11 to one of the polishing units 13, 14, 21 and 22 and the transfer ofthe clean and dry polished semiconductor wafer from the washing unit 15to the unloading unit 12 are carried out by the clean wafer handlingarm, and the transfer of the semiconductor wafer between the polishingunits 13, 14, 21 and 22 and the transfer of the polished semiconductorwafer from one of the polishing units 13, 14, 21 and 22 to the washingunit 15 are carried out by the dirty wafer handling arm. For example, inthe case of using the center robot 10 of FIG. 1, the arm 10-1 serves asthe clean wafer handling arm and the arm 10-2 serves as the dirty waferhandling arm. This structure prevents as much as possible thesemiconductor wafer from being contaminated.

According to this embodiment, the polishing apparatus comprises a centerrobot 10 having arms 10-1 and 10-2 and constituting a universal transferrobot for transferring a semiconductor wafer S to the respective units,a plurality of units disposed around the center robot 10 and including aloading unit 11 for receiving thereon the semiconductor wafer S to bepolished, e.g. a dry wafer, an unloading unit 12 for receiving thereonthe clean and dry semiconductor wafer S which has been polished, apolishing system including polishing units 13, 14, 21 and 22 each forpolishing the semiconductor wafer S and a washing unit 15 for washingand drying the semiconductor wafer S. The center robot 10 is providedwith an arm exclusively for handling a clean semiconductor wafer and anarm exclusively for handling a dirty semiconductor wafer. The arm forexclusively handling a dirty semiconductor wafer is washed by a washingmechanism provided in the washing unit 15 after handling the dirtysemiconductor wafer.

FIG. 11 shows still another embodiment of the polishing apparatusaccording to the present invention. The parts shown in FIG. 11 which areidentical to those of FIG. 1 are denoted by identical referencenumerals. In this embodiment, the polishing apparatus comprises atransfer structure including a center robot 10A for exclusively handlinga clean semiconductor wafer and a center robot 10B for exclusivelyhandling a dirty semiconductor wafer. Further, the polishing apparatuscomprises a polishing system including two polishing units 13, 14 and awashing unit 15.

With the above structure, a, e.g. dry, semiconductor wafer S is pickedup from a loading unit 11 by the center robot 10A and transferredthereby to a loading position 13-1 of the polishing unit 13. After apolishing operation, the polished semiconductor wafer S is picked upfrom the polishing unit 13 by the center robot 10B and transferredthereby to a loading position 15-1 of the washing unit 15. After washingand drying operation by washing and drying systems, the resultant cleanand dry polished semiconductor wafer S is picked up from a loadingposition 15-3 of the washing unit 15 by the center robot 10A andtransferred thereby to an unloading unit 12. By the above manner,polishing processes and washing and drying process are carried out. Apolishing operation is conducted by the polishing unit 14 in the samemanner as described above.

According to this embodiment, the semiconductor wafers S are polishedsimultaneously or at a certain time lag by the polishing units 13 and14, and each of the semiconductor wafers S polished by the polishingunits 13 and 14 is washed and dried by washing and drying systems in thewashing unit 15. That is, it is possible to deal with two semiconductorwafers with one washing unit for every two polishing units. Especiallyin the case where the cycle of the washing unit, i.e. the time intervalbetween washing of a preceding semiconductor wafer and washing of asubsequent semiconductor wafer, is sufficiently shorter than the timerequired to polish semiconductor wafers, there is no downtime during thepolishing operations. Thus, the processing speed of the overallapparatus is prevented from being lowered and the total system can bemore compact in size.

Further, the polishing units 13 and 14 can be set to polishsemiconductor wafers under different conditions and selected inaccordance with properties of the semiconductor wafers. Furthermore, asemiconductor wafer can be polished by the polishing unit 13, washed bythe washing unit 15, and then polished by the polishing unit 14.Thereafter, the semiconductor wafer S can be washed and dried by thewashing unit 15. That is, the semiconductor wafer can be polished twice.Such polishing apparatus has auxiliary spaces 18 and 19 as shown in FIG.11.

According to this embodiment, the polishing apparatus comprises twocenter robots 10A, 10B each constituting a universal transfer robot fortransferring a semiconductor wafer S to respective units, a plurality ofunits disposed around the center robots 10A and 10B and including aloading unit 11 for receiving thereon a semiconductor wafer S to bepolished, e.g. a dry wafer, an unloading unit 12 for receiving thereon aclean and dry semiconductor wafer S which has been polished, polishingunits 13 and 14 each for polishing a semiconductor wafer S and a washingunit 15 for washing and drying a semiconductor wafer S which has beenpolished. The center robot 10A handles only a clean semiconductor wafer,and the center robot 10B handles only a dirty semiconductor wafer. Thecenter robot 10B is washed by a washing mechanism provided in thewashing unit 15 after handling the dirty semiconductor wafer.

According to the above embodiments, since at least one polishing unitfor performing chemical/mechanical polishing and at least one washingand drying unit are disposed around a center robot, the entire system iscompact in size. Therefore, by providing an enclosing structure such asa housing unit (e.g. as shown at 30 in FIGS. 6, 6A) to cover the entiresystem and an exhaust duct, the polishing apparatus can be installed ina clean room without lowering the cleanliness thereof. Further, theamount of space in the clean room required for installation of thepolishing apparatus can be reduced.

In the above embodiments, although the loading unit 11 and the unloadingunit 12 are provided separately, the loading unit 11 and the unloadingunit 12 may be formed integrally. For example, in the case where asemiconductor wafer is picked up from a basket containing semiconductorwafers and is put into the same basket after undergoing a polishingoperation and washing and drying operations, the loading unit and theunloading unit are formed integrally.

The basket comprises a cassette which is placed on the loading unitand/or the unloading unit. A semiconductor wafer may be picked up from acassette on the loading unit and the unloading unit and may be put intothe same cassette on the loading unit and the unloading unit afterundergoing a polishing operation and washing and drying operations.Further, a semiconductor wafer may be picked up from a cassette on theloading unit and may be put into a cassette on the unloading unit afterundergoing a polishing operation and washing and drying operations.

The cassette which is placed on the loading unit and/or the unloadingunit may be in accordance with the structures shown in Ser. No.08/563,295 and Ser. No. 08/580,312, the disclosures of which hereby areincorporated herein by reference.

According to the present invention, a cluster type of polishingapparatus which integrates a plurality of units including a polishingunit defining a polishing systems and a washing and drying unit definingwashing and drying system and which employs a universal transfer robotcan be constructed. The polishing apparatus performs a series ofprocesses including a polishing operation and washing and dryingoperations while saving installation space and improving processingspeed by efficiently combining a plurality of units including at leastone polishing unit and at least one washing and drying unit. In the casewhere the time required for polishing is longer than the cycle time ofthe washing and drying operations, the polishing system can include, aplurality of polishing units to polish a plurality of semiconductorwafers and be associated washing and drying systems formed in onewashing and drying unit. On the contrary, in the case where the cycletime of the washing and drying operations is longer than the timerequired for polishing, the washing and drying systems can be formed bya plurality of washing and drying units to wash and dry a plurality ofsemiconductor wafers and be associated with a polishing system in theform of one polishing unit. Further, according to the present invention,one or more of each of polishing operations and one or more washing anddrying operations can be fully automated and can be changed or modifiedeasily.

Furthermore, according to the present invention, since the transferstructure includes exclusive means for handling a clean semiconductorwafer and exclusive means for handling a dirty semiconductor wafer thatare provided separately, contamination of subsequent semiconductorwafers or of respective units of the polishing apparatus caused by thedirty semiconductor wafer can be prevented.

Although the present invention has been described and illustrated withregard to specific features and embodiments thereof, it is to beunderstood that the present invention is not intended to be limited tosuch specifically described and illustrated features and embodiments.Rather, various modifications and changes to such specifically describedand illustrated features and embodiments as would be apparent to one ofordinary skill in the art are contemplated as being within the scope ofthe present invention.

We claim:
 1. A method for polishing and then washing a workpiece, saidmethod comprising:introducing said workpiece into an enclosing structuresuitable for use in a clean room and therein:polishing said workpiece toform a polished workpiece; washing said polished workpiece to form aclean polished workpiece; and drying said clean polished workpiece toform a clean and dry polished workpiece; and removing said clean and drypolished workpiece from said enclosing structure; and said washingcomprising conducting plural washing operations including a primarywashing operation and a secondary washing operation.
 2. A method asclaimed in claim 1, wherein said polishing comprises conducting pluralpolishing operations by plural polishing units.
 3. A method as claimedin claim 1, comprising transferring said clean and dry polishedworkpiece with at least one first mechanism that is discrete from atleast one second mechanism employed to transfer said polished workpiece.4. A method as claimed in claim 1, wherein said washing and drying arecarried out at a washing and drying station in a washing unit.
 5. Amethod as claimed in claim 1, wherein said washing and drying arecarried out at respective separate washing and drying stations in awashing unit.
 6. A method as claimed in claim 1, wherein said enclosingstructure is installed in said clean room.
 7. A method as claimed inclaim 6, wherein said introducing comprises carrying said workpiece fromthe interior of said clean room into said enclosing structure, and saidremoving comprises carrying said clean and dry polished workpiece fromsaid enclosing structure to said interior of said clean room.
 8. Amethod as claimed in claim 1, wherein said workpiece comprises asemiconductor wafer, said method is employed during manufacture of asemiconductor device.
 9. A method for polishing and then washing aworkpiece, said method comprising:introducing said workpiece into anenclosing structure suitable for use in a clean room andtherein:polishing said workpiece to form a polished workpiece; washingsaid polished workpiece to form a clean polished workpiece; and dryingsaid clean polished workpiece to form a clean and dry polishedworkpiece; removing said clean and dry polished workpiece from saidenclosing structure; transferring said workpiece to be polished and saidclean and dry polished workpiece with at least one first mechanism thatis discrete from at least one second mechanism employed to transfer saidpolished workpiece; and conducting said polishing and said washingaround at least one robot including said at least one first mechanism.10. A method as claimed in claim 9, wherein said polishing comprisesconducting plural polishing operations by plural polishing units.
 11. Amethod as claimed in claim 10, wherein said plural polishing operationscomprise plural sequential polishing operations conducted on saidworkpiece by said plural polishing units.
 12. A method as claimed inclaim 10, wherein said plural polishing operations are conducted onplural workpieces simultaneously or at a time lag by said pluralpolishing units.
 13. A method as claimed in claim 9, wherein said cleanand dry polished workpiece has a cleanliness substantially the same as acleanliness of said workpiece introduced into said enclosing structure.14. A method for polishing and then washing a workpiece, said methodcomprising:introducing said workpiece into an enclosing structuresuitable for use in a clean room and therein:polishing said workpiece toform a polished workpiece; washing said polished workpiece to form aclean polished workpiece; and drying said clean polished workpiece toform a clean and dry polished workpiece; removing said clean and drypolished workpiece from said enclosing structure; and transferring saidworkpiece to be polished and said clean and dry polished workpiece withat least one first robot that is discrete from at least one second robotemployed to transfer said polished workpiece.
 15. A method as claimed inclaim 14, wherein said polishing comprises conducting plural polishingoperations by plural polishing units.
 16. A method as claimed in claim15, wherein said plural polishing operations comprise plural sequentialpolishing operations conducted on said workpiece by said pluralpolishing units.
 17. A method as claimed in claim 15, wherein saidplural polishing operations are conducted on plural workpiecessimultaneously or at a time lag by said plural polishing units.
 18. Amethod as claimed in claim 14, wherein said clean and dry polishedworkpiece has a cleanliness substantially the same as a cleanliness ofsaid workpiece introduced into said enclosing structure.
 19. A methodfor polishing and then washing a workpiece, said methodcomprising:introducing said workpiece from the interior of a clean roominto an enclosing structure installed in said clean room; polishing saidworkpiece to form a polished workpiece; washing said polished workpieceto form a clean polished workpiece; drying said clean polished workpieceto form a clean and dry polished workpiece; and removing said clean anddry polished workpiece from said enclosing structure to said interior ofsaid clean room.
 20. A method as claimed in claim 19, wherein saidpolishing comprises conducting plural polishing operations by pluralpolishing units.
 21. A method as claimed in claim 20, wherein saidplural polishing operations comprise plural sequential polishingoperations conducted on said workpiece by said plural polishing units.22. A method as claimed in claim 20, wherein said plural polishingoperations are conducted on plural workpieces simultaneously or at atime lag by said plural polishing units.
 23. A method as claimed inclaim 19, wherein said clean and dry polished workpiece has acleanliness substantially the same as a cleanliness of said workpieceintroduced into said enclosing structure.
 24. A method as claimed inclaim 19, wherein said polishing is achieved by pressing said workpieceagainst an abrasive cloth, and further comprising dressing said abrasivecloth.
 25. A method as claimed in claim 19, wherein said washingcomprises conducting plural washing operations.
 26. A method as claimedin claim 25, wherein said plural washing operations include a primarywashing operation and a secondary washing operation.
 27. A method asclaimed in claim 19, further comprising rinsing said polished workpiecebefore said washing.
 28. A method as claimed in claim 27, comprisingconducting said rinsing at a first position and then conducting saidwashing at a second position different from said first position.
 29. Amethod as claimed in claim 28, further comprising transferring saidpolished workpiece from said first position to said second position. 30.A method as claimed in claim 19, further comprising exhausting anatmosphere within said enclosing structure to a location discrete fromsaid clean room in which said enclosing structure is located.
 31. Amethod as claimed in claim 19, further comprising measuring saidworkpiece at least one time after said introducing of said workpieceinto said enclosing structure and before said removing of said workpiecefrom said enclosing structure.
 32. A method as claimed in claim 31,wherein said enclosing structure is a housing.
 33. A method as claimedin claim 19, wherein said workpiece to be polished is a dry workpiece.34. A method as claimed in claim 19, comprising transferring said cleanand dry polished workpiece with at least one first mechanism that isdiscrete from at least one second mechanism employed to transfer saidpolished workpiece.
 35. A method as claimed in claim 34, wherein saidpolishing and said washing are conducted around at least one robotincluding said at least one first mechanism.
 36. A method as claimed inclaim 35, comprising one said robot having a robot arm, and conductingsaid transferring of said workpiece with said robot arm.
 37. A method asclaimed in claim 36, comprising conducting said transferring of saidclean and dry polished workpiece with said robot arm.
 38. A method asclaimed in claim 36, wherein said at least one second mechanismcomprises a polishing head supporting arm employed during saidpolishing.
 39. A method as claimed in claim 35, comprising one saidrobot having first and second robot arms, conducting said transferringof said workpiece with said first robot arm, and conducting saidtransferring of said clean and dry polished workpiece with said secondrobot arm.
 40. A method as claimed in claim 39, wherein said at leastone second mechanism comprises a polishing head supporting arm employedduring said polishing.
 41. A method as claimed in claim 35, comprisingone said robot having a first robot arm comprising said at least onefirst mechanism and a second robot arm comprising said at least onesecond mechanism.
 42. A method as claimed in claim 34, comprising afirst robot comprising said at least one first mechanism and a secondrobot comprising said at least one second mechanism.
 43. A method asclaimed in claim 19, wherein said drying comprises spin-drying saidclean polished workpiece.
 44. A method as claimed in claim 19, whereinsaid washing and drying are carried out at a washing and drying stationin a washing unit.
 45. A method as claimed in claim 19, wherein saidwashing and drying are carried out at respective separate washing anddrying stations in a washing unit.
 46. A method as claimed in claim 19,wherein said polishing is conducted by a polishing apparatus including atop ring for holding said workpiece, and further comprising washing saidtop ring after releasing said polished workpiece.
 47. A method asclaimed in claim 19, further comprising inverting said workpiece beforesaid polishing.
 48. A method as claimed in claim 47, further comprisinginverting said polished workpiece after said polishing and before saidclean and dry polished workpiece is removed from said enclosingstructure.
 49. A method as claimed in claim 19, wherein said workpieceis taken out from a first container on a loading unit containingworkpieces to be polished, and said clean and dry polished workpiece isput into a second container at an unloading unit.
 50. A method asclaimed in claim 19, wherein said workpiece is taken out from acontainer on a loading unit containing workpieces to be polished, andsaid clean and dry polished workpiece is returned into said container.51. A method as claimed in claim 19, wherein said enclosing structure isa housing.
 52. A method as claimed in claim 19, wherein said workpiececomprises a semiconductor wafer, said method being a method for use inmanufacturing a semiconductor device.
 53. An apparatus for polishing andthen washing a workpiece, said apparatus comprising:an enclosingstructure capable of containing and preventing an atmosphere within saidenclosing structure from escaping therefrom to exterior thereof; aloading unit for receipt of a workpiece to be polished; a polishingsystem within said enclosing structure for polishing the workpiece toform a polished workpiece, said polishing system including an abrasivecloth that is used for polishing; a washing system within said enclosingstructure for washing the polished workpiece to form a clean polishedworkpiece; a drying system within said enclosing structure for dryingthe clean polished workpiece to form a clean and dry polished workpiece;an unloading unit for receiving the clean and dry polished workpiece;transfer structure for transferring the polished workpiece from saidpolishing system to said washing system and for transferring the cleanand dry polished workpiece from said drying system to said unloadingunit; and a dressing mechanism for dressing said abrasive cloth, saiddressing mechanism comprising a dressing tool that is removably attachedto a polishing head supporting arm of a polishing unit of said polishingsystem.
 54. An apparatus for polishing and then washing a workpiece,said apparatus comprising:an enclosing structure capable of containingand preventing an atmosphere within said enclosing structure fromescaping therefrom to exterior thereof; a loading unit for receipt of aworkpiece to be polished; a polishing system within said enclosingstructure for polishing the workpiece to form a polished workpiece; awashing system within said enclosing structure for washing the polishedworkpiece to form a clean polished workpiece; a drying system withinsaid enclosing structure for drying the clean polished workpiece to forma clean and dry polished workpiece; an unloading unit for receiving theclean and dry polished workpiece; transfer structure for transferringthe polished workpiece from said polishing system to said washing systemand for transferring the clean and dry polished workpiece from saiddrying system to said unloading unit; and said washing system includingplural washing stations operable to achieve plural washing operations,said plural washing stations including a primary washing station and asecondary washing station.
 55. An apparatus as claimed in claim 54,wherein said polishing system includes plural polishing units.
 56. Anapparatus as claimed in claim 55, wherein said plural polishing unitsare operable to conduct plural sequential polishing operations on theworkpiece.
 57. An apparatus as claimed in claim 56, wherein saidtransfer structure is operable to transfer the workpiece between saidplural polishing units.
 58. An apparatus as claimed in claim 55, whereinsaid plural polishing units are operable to conduct polishing operationson plural workpieces simultaneously or at a time lag.
 59. An apparatusas claimed in claim 54, wherein said polishing system includes anabrasive cloth that is used for polishing, and further comprising adressing mechanism for dressing said abrasive cloth.
 60. An apparatus asclaimed in claim 54, wherein said enclosing structure is a housing. 61.An apparatus as claimed in claim 54, further comprising a rinsing devicefor rinsing the polished workpiece at a first position that is upstreamof and separate from a second position at which is located said primarywashing station.
 62. An apparatus as claimed in claim 54, furthercomprising an exhaust duct for exhausting an atmosphere within saidenclosing structure to a location discrete from a room in which saidenclosing structure is located.
 63. An apparatus as claimed in claim 54,further comprising a measuring device for measuring the workpiece atleast one time after receipt of the workpiece at said loading unit andbefore receiving of the clean and dry polished workpiece at saidunloading unit.
 64. An apparatus as claimed in claim 54, wherein saidloading unit is operable to receive a dry workpiece to be polished. 65.An apparatus as claimed in claim 54, further comprising a storage unitdisposed adjacent to at least one of said loading unit and saidunloading unit for storing workpieces to be polished and clean and drypolished workpieces.
 66. An apparatus as claimed in claim 54, furthercomprising a unit having a meter capable of measuring a polishedthickness of the workpiece.
 67. An apparatus as claimed in claim 54,wherein said washing system includes a washing unit, and said dryingsystem comprises a spin-dryer in said washing unit for spin-drying theclean polished workpiece.
 68. An apparatus as claimed in claim 54,wherein said washing system and said drying system include a singlecombined station for washing and drying the polished workpiece.
 69. Anapparatus as claimed in claim 54, wherein said washing system and saiddrying system include separate washing and drying stations forrespectively washing and drying the polished workpiece.
 70. An apparatusas claimed in claim 54, further comprising a washing mechanism forwashing a top ring of said polishing system for holding the workpieceafter releasing the polished workpiece.
 71. An apparatus as claimed inclaim 54, further comprising an inverting mechanism for inverting theworkpiece to be polished.
 72. An apparatus as claimed in claim 54,further comprising an inverting mechanism for inverting the polishedworkpiece.
 73. An apparatus as claimed in claim 54, wherein said loadingunit is operable to receive a container for containing workpieces to bepolished.
 74. An apparatus as claimed in claim 54, wherein saidunloading unit is operable to receive a container for receiving cleanand dry polished workpieces.
 75. An apparatus as claimed in claim 54,wherein said loading unit and said unloading unit are operable toreceive respective containers.
 76. An apparatus as claimed in claim 54,wherein said loading unit and said unloading unit are formed integrallyto be operable to receive a container for containing workpieces to bepolished and to receive clean and dry polished workpieces.
 77. Anapparatus as claimed in claim 54, wherein the workpiece is asemiconductor wafer, and said apparatus is employable for manufacture ofa semiconductor device.
 78. An apparatus for polishing and then washinga workpiece, said apparatus comprising:an enclosing structure capable ofcontaining and preventing an atmosphere within said enclosing structurefrom escaping therefrom to exterior thereof; a loading unit for receiptof a workpiece to be polished; a polishing system within said enclosingstructure for polishing the workpiece to form a polished workpiece; awashing system within said enclosing structure for washing the polishedworkpiece to form a clean polished workpiece; a drying system withinsaid enclosing structure for drying the clean polished workpiece to forma clean and dry polished workpiece; an unloading unit for receiving theclean and dry polished workpiece; and transfer structure fortransferring the polished workpiece from said polishing system to saidwashing system and for transferring the clean and dry polished workpiecefrom said drying system to said unloading unit, said transfer structurecomprising at least one first transfer mechanism for transferring theworkpiece to be polished and for transferring the clean and dry polishedworkpiece, and at least one second transfer mechanism for transferringthe polished workpiece, and said at least one first transfer mechanismcomprising a single robot arm of a robot operable to transfer both theworkpiece to be polished and the clean and dry polished workpiece. 79.An apparatus as claimed in claim 78, wherein said polishing systemincludes plural polishing units.
 80. An apparatus as claimed in claim78, wherein said enclosing structure is a housing.
 81. An apparatus asclaimed in claim 78, wherein said washing system includes a washingunit, and said drying system comprises a spin-dryer in said washing unitfor spin-drying the clean polished workpiece.
 82. An apparatus asclaimed in claim 78, wherein said loading unit and said unloading unitare formed integrally to be operable to receive a container forcontaining workpieces to be polished and to receive clean and drypolished workpieces.
 83. An apparatus as claimed in claim 78, whereinthe workpiece is a semiconductor wafer, and said apparatus is employablefor manufacture of a semiconductor device.
 84. An apparatus forpolishing and then washing a workpiece, said apparatus comprising:anenclosing structure capable of containing and preventing an atmospherewithin said enclosing structure from escaping therefrom to exteriorthereof; a loading unit for receipt of a workpiece to be polished; apolishing system within said enclosing structure for polishing theworkpiece to form a polished workpiece; a washing system within saidenclosing structure for washing the polished workpiece to form a cleanpolished workpiece; a drying system within said enclosing structure fordrying the clean polished workpiece to form a clean and dry polishedworkpiece; an unloading unit for receiving the clean and dry polishedworkpiece; and transfer structure for transferring the polishedworkpiece from said polishing system to said washing system and fortransferring the clean and dry polished workpiece from said dryingsystem to said unloading unit, said transfer structure comprising atleast one first transfer mechanism for transferring the workpiece to bepolished and for transferring the clean and dry polished workpiece, andat least one second transfer mechanism for transferring the polishedworkpieces, and said at least one first transfer mechanism comprising afirst robot arm of a robot operable to transfer the workpiece to bepolished, and a second robot arm of said robot operable to transfer theclean and dry polished workpiece.
 85. An apparatus as claimed in claim84, wherein said polishing system includes plural polishing units. 86.An apparatus as claimed in claim 84, wherein said enclosing structure isa housing.
 87. An apparatus as claimed in claim 84, wherein said washingsystem includes a washing unit, and said drying system comprises aspin-dryer in said washing unit for spin-drying the clean polishedworkpiece.
 88. An apparatus as claimed in claim 84, wherein said loadingunit and said unloading unit are formed integrally to be operable toreceive a container for containing workpieces to be polished and toreceive clean and dry polished workpieces.
 89. An apparatus as claimedin claim 84, wherein the workpiece is a semiconductor wafer, and saidapparatus is employable for manufacture of a semiconductor device. 90.An apparatus for polishing and then washing a workpiece, said apparatuscomprising:an enclosing structure capable of containing and preventingan atmosphere within said enclosing structure from escaping therefrom toexterior thereof; a loading unit for receipt of a workpiece to bepolished; a polishing system within said enclosing structure forpolishing the workpiece to form a polished workpiece; a washing systemwithin said enclosing structure for washing the polished workpiece toform a clean polished workpiece; a drying system within said enclosingstructure for drying the clean polished workpiece to form a clean anddry polished workpiece; an unloading unit for receiving the clean anddry polished workpiece; and transfer structure for transferring thepolished workpiece from said polishing system to said washing system andfor transferring the clean and dry polished workpiece from said dryingsystem to said unloading unit, said transfer structure comprising atleast one first transfer mechanism for transferring the workpiece to bepolished and for transferring the clean and dry polished workpiece, andat least one second transfer mechanism for transferring the polishedworkpiece, said at least one first transfer mechanism comprising a firstrobot arm of a robot, and said at least one second transfer mechanismcomprising a second robot arm of said robot.
 91. An apparatus as claimedin claim 90, wherein said polishing system includes plural polishingunits.
 92. An apparatus as claimed in claim 90, wherein said enclosingstructure is a housing.
 93. An apparatus as claimed in claim 90, whereinsaid washing system includes a washing unit, and said drying systemcomprises a spin-dryer in said washing unit for spin-drying the cleanpolished workpiece.
 94. An apparatus as claimed in claim 90, whereinsaid loading unit and said unloading unit are formed integrally to beoperable to receive a container for containing workpieces to be polishedand to receive clean and dry polished workpieces.
 95. An apparatus asclaimed in claim 90, wherein the workpiece is a semiconductor wafer, andsaid apparatus is employable for manufacture of a semiconductor device.96. An apparatus for polishing and then washing a workpiece, saidapparatus comprising:an enclosing structure capable of containing andpreventing an atmosphere within said enclosing structure from escapingtherefrom to exterior thereof; a loading unit for receipt of a workpieceto be polished; a polishing system within said enclosing structure forpolishing the workpiece to form a polished workpiece; a washing systemwithin said enclosing structure for washing the polished workpiece toform a clean polished workpiece; a drying system within said enclosingstructure for drying the clean polished workpiece to form a clean anddry polished workpiece; an unloading unit for receiving the clean anddry polished workpiece; and transfer structure for transferring thepolished workpiece from said polishing system to said washing system andfor transferring the clean and dry polished workpiece from said dryingsystem to said unloading unit, said transfer structure comprising atleast one first transfer mechanism for transferring the workpiece to bepolished and for transferring the clean and dry polished workpiece, andat least one second transfer mechanism for transferring the polishedworkpiece, said at least one first transfer mechanism comprising a firstrobot arm of a robot, and said at least one second transfer mechanismcomprising a robot arm of another robot.
 97. An apparatus as claimed inclaim 96, wherein said polishing system includes plural polishing units.98. An apparatus as claimed in claim 96, wherein said enclosingstructure is a housing.
 99. An apparatus as claimed in claim 96, whereinsaid washing system includes a washing unit, and said drying systemcomprises a spin-dryer in said washing unit for spin-drying the cleanpolished workpiece.
 100. An apparatus as claimed in claim 96, whereinsaid loading unit and said unloading unit are formed integrally to beoperable to receive a container for containing workpieces to be polishedand to receive clean and dry polished workpieces.
 101. An apparatus asclaimed in claim 96, wherein the workpiece is a semiconductor wafer, andsaid apparatus is employable for manufacture of a semiconductor device.102. A method for polishing and then washing a workpiece, said methodcomprising:transferring a workpiece from a loading unit to a polishingsystem; polishing said workpiece at said polishing system; transferringsaid workpiece from said polishing system to a washing system; washingsaid workpiece at said washing system; transferring said workpiece in aclean and dry condition to an unloading unit; conducting said polishingand said washing in an enclosing structure capable of containing andpreventing an atmosphere within said enclosing structure from escapingtherefrom to exterior thereof; conducting said transferring of saidworkpiece in said clean and dry condition to said unloading unit by atransfer structure; and said washing comprising conducting pluralwashing operations including a primary washing operation and a secondarywashing operation.
 103. A method as claimed in claim 102, wherein saidpolishing comprises conducting plural polishing operations by pluralpolishing units of said polishing system.
 104. A method as claimed inclaim 103, wherein said plural polishing operations comprise pluralsequential polishing operations conducted on said workpiece by saidplural polishing units.
 105. A method as claimed in claim 103, whereinsaid plural polishing operations are conducted on plural workpiecessimultaneously or at a time lag by said plural polishing units.
 106. Amethod as claimed in claim 102, wherein said workpiece transferred tosaid unloading unit has a cleanliness substantially the same as acleanliness of said workpiece transferred to said polishing system. 107.A method as claimed in claim 102, further comprising rinsing thepolished workpiece at a first position, and then conducting said primarywashing operation at a second position different from said firstposition.
 108. A method as claimed in claim 107, further comprisingtransferring said polished workpiece from said first position to saidsecond position by said transfer structure.
 109. A method as claimed inclaim 102, further comprising measuring the workpiece at least one timeafter introducing of the workpiece into said enclosing structure andbefore removing of the workpiece from said enclosing structure.
 110. Amethod as claimed in claim 102, comprising conducting said washing ofsaid workpiece and conducting drying of said workpiece at said washingsystem.
 111. A method as claimed in claim 102, wherein said polishingsystem includes a top ring for holding said workpiece, and furthercomprising washing said top ring after releasing said polishedworkpiece.
 112. A method as claimed in claim 102, wherein said workpieceis taken out from a first container at said loading unit containingworkpieces to be polished, and said workpiece in said clean and drycondition is put into a second container at said unloading unit.
 113. Amethod as claimed in claim 102, wherein said workpiece is taken out froma container at said loading unit containing workpieces to be polished,and said workpiece in said clean and dry condition is returned into saidcontainer.
 114. A method for polishing and then washing a workpiece,said method comprising:transferring a workpiece from a loading unit to apolishing system; polishing said workpiece at said polishing system;transferring said workpiece from said polishing system to a washingsystem; washing said workpiece at said washing system; transferring saidworkpiece in a clean and dry condition to an unloading unit; conductingsaid polishing and said washing in an enclosing structure capable ofcontaining and preventing an atmosphere within said enclosing structurefrom escaping therefrom to exterior thereof; conducting saidtransferring of said workpiece in said clean and dry condition to saidunloading unit by a transfer structure; conducting said transferring ofsaid workpiece from said loading unit to said polishing system by saidtransfer structure; conducting said transferring of said workpiece tosaid polishing system and said transferring of said workpiece in saidclean and dry condition by at least one first mechanism of said transferstructure that is discrete from at least one second mechanism thereofthat is employed to transfer said workpiece to said washing system; andconducting said polishing and said washing around at least one robotincluding said at least one first mechanism.
 115. A method as claimed inclaim 114, wherein said polishing comprises conducting plural polishingoperations by plural polishing units of said polishing system.
 116. Amethod as claimed in claim 114, comprising one said robot having firstand second robot arms, conducting said transferring of said workpiece tosaid polishing system with said first robot arm, and conducting saidtransferring to said unloading unit with said second robot arm.
 117. Amethod as claimed in claim 116, wherein said at least one secondmechanism comprises a polishing head supporting arm of said polishingsystem.
 118. A method as claimed in claim 114, comprising conductingsaid washing of said workpiece and conducting drying of said workpieceat said washing system.
 119. A method as claimed in claim 114, whereinsaid polishing system includes a top ring for holding said workpiece,and further comprising washing said top ring after releasing saidpolished workpiece.
 120. A method as claimed in claim 114, wherein saidenclosing structure is installed in a clean room.
 121. A method forpolishing and then washing a workpiece, said methodcomprising:transferring a workpiece from a loading unit to a polishingsystem; polishing said workpiece at said polishing system; transferringsaid workpiece from said polishing system to a washing system; washingsaid workpiece at said washing system; transferring said workpiece in aclean and dry condition to an unloading unit; conducting said polishingand said washing in an enclosing structure capable of containing andpreventing an atmosphere within said enclosing structure from escapingtherefrom to exterior thereof; conducting said transferring of saidworkpiece in said clean and dry condition to said unloading unit by atransfer structure; conducting said transferring of said workpiece fromsaid loading unit to said polishing system by said transfer structure;and conducting said transferring of said workpiece to said polishingsystem and said transferring of said workpiece in said clean and drycondition by at least one first robot of said transfer structure that isdiscrete from at least one second robot thereof that is employed totransfer said workpiece to said washing system.
 122. A method as claimedin claim 121, wherein said polishing comprises conducting pluralpolishing operations by plural polishing units of said polishing system.123. A method as claimed in claim 121, wherein said polishing systemincludes a top ring for holding said workpiece, and further comprisingwashing said top ring after releasing said polished workpiece.
 124. Amethod as claimed in claim 121, wherein said enclosing structure isinstalled in a clean room.